TDK ModCap UHP DC Link capacitors hit 105°C without derating

DK’s ModCap UHP DC link capacitors are available in three variants spanning 1350 V to 1800 V, each rated for 200,000-hour lifetime at +105°C without derating for use with SiC-based power converters

(Image courtesy of TDK Corporation)

TDK Corporation has introduced the ModCap UHP (B25648A) series of DC link capacitors for power electronic applications, targeting the fast-growing market for silicon carbide-based converters. The series delivers continuous operation at hotspot temperatures up to +105°C without power derating — a thermal ceiling that directly benefits renewable energy converters, energy storage systems, and industrial drives where thermal management remains a persistent design constraint.

ModCap UHP DC link capacitors push thermal limits

Previous ModCap generations required derating from +90°C, restricting current density and shortening operating margins in thermally demanding installations. TDK’s new design resolves this by pairing a high-temperature dielectric with a modular architecture, extending rated lifetime to 200,000 hours at +105°C while achieving 20% higher current density than prior generations.

The series carries a DC voltage rating of 1350 V to 1800 V with capacitance values from 470 µF to 880 µF. These parameters make the ModCap UHP DC link capacitors a direct fit for SiC semiconductor-based inverters, where low parasitic inductance is critical. An equivalent series inductance of 8 nH reduces the need for additional snubber capacitors, supporting more compact converter layouts.

The cubic housing measures 205 x 90 x 170 mm and is designed for busbar integration, increasing power density in space-constrained converter cabinets. Target applications include solar and wind power converters, electrolyzer systems, energy storage, auxiliary drives in traction applications, and industrial motor drives.

SiC compatibility meets bio-circular materials in the ModCap UHP Series

Compatibility with fast-switching SiC semiconductors drives the case for film capacitors with low ESL and high-frequency performance. The ModCap UHP meets these requirements while adding sustainability credentials: the dielectric film uses ISCC-certified bio-circular BOPP, and the housing complies with UL94 V-0 flammability and EN 45545-2 HL3 R23 railway fire standards. UL recognition is currently pending.

Three ordering codes are available. The B25648A1887K003 provides 880 µF at 1350 V with a rated current of 205 A at +75°C. The B25648A1647K003 offers 640 µF at 1600 V rated at 190 A, and the B25648A1477K003 delivers 470 µF at 1800 V rated at 180 A.

TDK supports the series with engineering tools including a SPICE library for circuit simulation, the web-based Capacitor Life and Rating Application (CLARA) for lifetime calculation, and CAP Thermal for thermal modelling. As SiC adoption accelerates across renewable energy and industrial power conversion, TDK positions the ModCap UHP as the solution for DC link stages where the previous generation’s +90°C derating threshold has become a binding design constraint.

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